| Chips & Technologies 6xxxx chip markings |
| Prefix Codes - defines type of product: package, board or software |
B - Component in Ball Grid Array package (BGA)
F - Component in Plastic Quad Flat Pack package (PQFP)
M - Component in Mini BGA package (mBGA)
T - Component in Thin Quad Flat Pack package (TQFP)
DK - Development Kit
AB - Adapter Board
MM - Multimedia Module
DR - Software Driver |
| Part Designator |
i.e. 69000 - HiQVideo™ Accelerator with 2 Meg Embedded Memory. |
| Devices revision - defines the revision level of silicon. |
The initial release of the device won't have a letter. The first revision
is A, second is B, etc. Some devices have will have minor revisions shown
as a letter and number like /B2 as in F65545/B2.41.
A minor revision is usually only a single mask layer change. |
| Suffix Codes - foundry / packaging house (no longer used) |
.41 = TSMC/ANAM
.47 = SAMSUNG/SAMSUNG
.62 = TSMC/CAESAR
.45 = TSMC/ASAT
.16 = CHARTER/ASAT |
